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US Patent Issued to Taiwan Semiconductor Manufacturing on July 14 for "Manufacturing method of the semiconductor package, pick and place device, and workpiece handling apparatus" (Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,069, issued on July 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Manufacturing method of the semicon... Read More


US Patent Issued to Sandisk Technologies on July 14 for "Integrated die ejector for die attach ejector devices" (Chinese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,070, issued on July 14, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.). "Integrated die ejector for die attach ejector device... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 14 for "Semiconductor wafer processing tool with improved leak check" (Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,071, issued on July 14, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor wafer processing ... Read More


US Patent Issued to Kulicke and Soffa Hi-Tech on July 14 for "Working station systems for dispensing a fluid in connection with electronics assembly" (Taiwanese Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,072, issued on July 14, was assigned to Kulicke and Soffa Hi-Tech Co. Ltd. (New Tapei City, Taiwan). "Working station systems for dispensin... Read More


US Patent Issued to SEMES on July 14 for "Auto teaching apparatus including test substrate and auto teaching method using distance measuring sensor" (South Korean Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,073, issued on July 14, was assigned to SEMES Co. LTD. (Chungcheongnam-Do, South Korea). "Auto teaching apparatus including test substrate ... Read More


US Patent Issued to Applied Materials on July 14 for "Apparatus, systems, and methods of measuring edge ring distance for thermal processing chambers" (American, German Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,074, issued on July 14, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Apparatus, systems, and methods of measuring edge ri... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on July 14 for "Method for mapping wafers in a wafer carrier" (Taiwanese Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,075, issued on July 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Method for mapping wafers in a wafe... Read More


US Patent Issued to Applied Materials on July 14 for "Pressure puck diagnostic wafer" (American, French Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,076, issued on July 14, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Pressure puck diagnostic wafer" was invented by Kost... Read More


US Patent Issued to GUDENG PRECISION INDUSTRIAL on July 14 for "Reticle pod having anti-collision gap structure" (Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,077, issued on July 14, was assigned to GUDENG PRECISION INDUSTRIAL Co. LTD. (New Taipei City, Taiwan). "Reticle pod having anti-collision ... Read More


US Patent Issued to Applied Materials on July 14 for "Semiconductor process equipment" (Indian, American, German Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,078, issued on July 14, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Semiconductor process equipment" was invented by Bha... Read More